Surface analysis and processing technique
Focussed ion beam (FIB) scanning electron microscopy (SEM)
High-voltage ion milling for controlled micro-cuts and -grooves
Surface and subsurface chacaterisation
Image and understand the architecture of a sample
Backscattered electron and secondary electron imaging
Manipulate Samples, i.e. create or repair lokalized defects
low-voltage creation for high-quality TEM lamella (TEM sample preparation)
Installation and Device History
The setup was purchased in 2020 (Link to specifications, Link to brochure) and installed after finishing the new CleanRoom in the SupraFab building in 2022.
During the installation (Nov 2022), the setup was properly installed - and we got a proper introduction into the performance of the system.
The application training will follow in the beginning of 2023
- GIS exchange after 4 month usage → Need to adapt usage of GIS
Documents and Operation
* Manuals: User manual,
Getting startet
* Superuser: Bianca, Sviat
